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2006,18

Cristina E. Beldica, Harry H. Hilton, Sung Yi

Viscoelastic damping and piezo-electric control of structures subjected to aerodynamic noise

language: English

received 27.11.2006, published 28.12.2006

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ABSTRACT

Analytical and numerical simulations are carried out in order to identify physical parameters affecting acoustic and motion control by viscoelastic piezo-electric and material damping. Numerical simulations in terms of critical parameters, such as relaxation functions of the structure and piezo-electric devices, aerodynamic coefficients, Mach number, are carried out to evaluate their sensitivity to system responses, sensing and structural control. Computational simulations indicate that light weight piezo-electric viscoelastic devices can be effectively used to actively or passively control flight vehicle structural response to aerodynamic noise.

15 pages, 14 figures

Сitation: Cristina E. Beldica, Harry H. Hilton, Sung Yi. Viscoelastic damping and piezo-electric control of structures. Electronic Journal “Technical Acoustics”, http://www.ejta.org, 2006, 18.

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Cristina E. Beldica holds an MS in Aeronautical Engineering from the University Politehnica of Bucharest, Romania and a Ph.D. in Engineering Mechanics from the University of Illinois at Chicago. She has been at University of Illinois at Urbana-Champaign (UIUC) since 1996. Prior to this she has served as Research Assistant at University of Illinois at Chicago, Assistant Professor at the University Politehnica of Bucharest and R&D Engineer at ICA Aircraft Manufacturing, Romania. Currently, she is a Program Manager at the National Center for Supercomputer Applications (NCSA) at the UIUC. She also holds a joint appointment in the Aerospace Engineering (AE) Department at UIUC. Nationally, she is a member of the American Institute of Aeronautics and Astronautics Technical Committee on Structures and an Associate Fellow.
Dr. Beldica's research interests include characterization of viscoelastic materials, linear and nonlinear stress analysis, fracture properties of reinforced composites. Currently she is working on aero-thermo-viscoelastic studies on divergence, flutter and aerodynamic noise response and control, on optimum anisotropic viscoelastic damping properties of composites and on intelligent and piezoelectric viscoelastic materials. She has developed and used computer code for stress analysis based on finite and boundary element algorithms. She has performed 2D and 3D numerical simulations of curing processes in thermosetting composite materials. Her work also includes numerical and experimental analysis of fracture, crack growth characteristics and scale effects in composites with long fibers.

 
 

Harry H. Hilton received a BS and an MS in Aeronautical Engineering from New York University and a PhD in Theoretical and Applied Mechanics with a minor in mathematics from UIUC. At UIUC he has been AE department head from 1974 to 1985 and an assistant dean of engineering during the summers of 1989 and 1990. Currently, he is Professor Emeritus of AE and Senior Academic Lead for Computational Structural Mechanics at NCSA. He also holds an appointment as Charles E. Schmidt Distinguished Visiting Professor at Florida Atlantic University. He is a member of several international and national scientific committees, which organize technical conferences and set policies, standards and future planning in aerospace, high performance computing and mechanics. He is an AIAA Fellow.
Since his retirement in 1990, he continues to be actively engaged in research, graduate teaching, MS and PhD thesis advising and in public and professional service. His recent analytical and computational research and extensive publication areas are deterministic and stochastic linear and nonlinear viscoelasticity, composites, aero-viscoelasticity, computational solid mechanics and probabilistic failure criteria and analysis. Some specific subsets include: viscoelastic failure analysis with random properties and loads, aeroelasticity, damping, nonlinear dynamics, linear and nonlinear anisotropic viscoelastic finite element analysis, piezoelectric viscoelastic materials, electronic packaging, nonlinear creep and delamination column and plate buckling, analytical determination of damping properties, stochastic minimum structural weight analysis, probabilistic delamination of composites during service, manufacturing processes (cure) and structural integrity of dentures.

e-mail: h-hilton(at)uiuc.edu

 
 

Sung Yi holds an associate professor position in the Mechanical Engineering Department at the Portland State University, Oregon. Sung Yi was awarded a Ph.D. degree in aeronautical and astronautical engineering from the University of Illinois at Urbana-Champaign in 1992. His primary teaching and research interests lie in the areas of electronic packaging, delamination & failure mechanisms of electronic packages and composites, constitutive modeling and characterization of materials, computational simulation, etc.
In 1991, Dr. Yi developed a time-dependent failure criterion for delamination onsets in laminated composites, thereby significantly contributing to the prediction of life times of composites and received the Jefferson Goblet paper award at the 32nd AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference, Baltimore, MD. He also received the Roger A. Strehlow Memorial Award for his outstanding research accomplishment in UIUC in 1992. He co-developed the "Yi-Hilton model’’ to describe the chemo-thermo-viscoelastic behavior for thermosetting polymers during curing. Recently, he co-created a new technical term "piezoelectro-hygro-thermo-viscoelasticity" for PVDF smart materials and successfully formulated the variational principle for piezo-electro-hygro-thermo-viscoelastic materials. He is the first one who formulated based on coupling hygro-thermo-viscoelastic physics and solved the pop-corn problem which is one of the most critical reliability problems in plastic IC packages. He also developed the system to measure in-situ moisture ingress in IC packages and polymers with complex geometry and to calculate their diffusion properties accurately. Most of his current research efforts have direct applications to the critical technologies needed in developing the next generation of IC packages.
He is an associate fellow of the AIAA and is an editorial advisory board member for the Journal of Soldering and Surface Mount Technology. In 1996, he was invited as a guest editor for a special issue on "Application of FEA in Electronic Packaging" for the Journal of Finite Elements in Analysis and Design.